Paper Publications
Release time: 2021-05-13Hits:
- Affiliation of Author(s):材料科学与工程学院
- Journal:INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE
- Key Words:Grain boundary engineering; copper; corrosion pits; dibenzyl disulfide; breakdown voltage; ion mobility
- Co-author:何潇,许志龙,郭新良,夏桓桓
- First Author:袁媛
- Indexed by:Journal paper
- Document Code:138108
- Volume:10
- Issue:12
- Page Number:15
- ISSN No.:1452-3981
- Translation or Not:no
- Date of Publication:2015-01-01
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